Solderable Plastic EMI Shielding
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United States of America Patent
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Issued Date -
Nov 15, 2007
app pub date -
May 4, 2007
filing date -
May 12, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An electromagnetic interference shield includes a polymer thin film metalized with conductive metals and a solderable material deposited over the conductive metals. The solderable material has a low melting temperature so that the solder can be heated to form a weld joint between a chip (or component) and the solder without damaging the metalized polymer thin film. One example of a low melting temperature solder is SnBi.
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