Copper-pillar plugs for semiconductor die
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Mar 13, 2007
filing date -
May 9, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A plurality of small diameter, closely spaced openings are formed in the back of a semiconductor wafer and are filled with copper plugs in areas of the wafer where the effect of thinning is desired. The openings may be holes of any desired cross-section with a width or diameter of 3 to 5 .mu.m and a center-to-center spacing of about 50 .mu.m. The posts can have a depth of 180 .mu.m or greater in a wafer having a thickness of 200 .mu.m or greater. The wafer can be silicon, silicon carbide, gallium nitride, or any substrate used for semiconductor device fabrication.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully