High speed, controlled impedance air dielectric electronic backplane systems
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jun 19, 2003
app pub date -
Oct 17, 2002
filing date -
Nov 3, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A novel backplane interconnection system that is useful in the telecommunication and data process industries for ultra high speed backplane systems. It is capable of transmitting digital signals with bandwidths of 10 GHz and beyond. The invention provides high performance at a low cost of manufacture. It is suitable for use in a wide variety of system applications. One embodiment of the invention comprises an air dielectric and copper conductor matched impedance transmission line system that interconnects daughter cards in a conventional backplane configuration. The high speed transmission-line structure is continuous through the backplane-daughter card and return path. Such embodiment are also integrated with conventional printed circuit backplanes or be a stand-alone device.
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