Molding device for an expandable interspinous process implant

United States of America Patent

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Aug 28, 2012
Grant Date
Nov 22, 2007
app pub date
Apr 28, 2006
filing date
Apr 28, 2006

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Expired

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Abstract

A molding device is disclosed and can include a first mold component and a second mold component substantially opposite the first mold component. The first mold component and the second mold component can fit around a superior spinous process and an inferior spinous process.

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Patent Owner(s)

Patent Owner	Address
WARSAW ORTHOPEDIC INC	2500 SILVEUS CROSSING WARSAW IN 46582

International Classification(s)

A61B:DIAGNOSIS; SURGERY; IDENTIFICATION

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Anderson, Kent M	Memphis, US	85	9806
Bruneau, Aurelien	Memphis, US	55	7935
Carls, Thomas	Memphis, US	58	6544
Lange, Eric C	Collierville, US	134	15482
Lim, Roy	Memphis, US	71	10108
Trieu, Hai H	Cordova, US	241	26134

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Molding device for an expandable interspinous process implant

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11414445

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PATENT NO	8252031
APP PUB NO	20070270829A1
SERIAL NO	11414445
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
August 28, 2012	US,8252031,B2 US8252031B2	GRANTED PATENT AS SECOND PUBLICATION
November 22, 2007	US,20070270829,A1 US20070270829A1	FIRST PUBLISHED PATENT APPLICATION

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11414445

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