Image sensor package having mount holder attached to image sensor die
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Nov 29, 2007
app pub date -
Apr 27, 2005
filing date -
Apr 27, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An image sensor package and a method for manufacturing the same are disclosed. For example, a mount holder is directly attached on an image sensor die, not a substrate. Here, on the mount holder, a lens or a barrel having lens are attached. Also, the mount holder is interlocked by an encapsulant, so that it is not easily separated from the image sensor. Accordingly, the width of the mount holder can be smaller than that of the image sensor die, so that the entire width of the image sensor package becomes smaller. Moreover, the electrically conductive wire is located at the outside of the mount holder and is perfectly surrounded by the encapsulant, thereby preventing the oxidization of the wire.
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