Spring connector for making electrical contact at semiconductor scales
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United States of America Patent
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Aug 2, 2011
Grant Date -
Nov 29, 2007
app pub date -
Feb 14, 2007
filing date -
Dec 8, 2003
priority date (Note) -
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Abstract
A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.
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