Method For Silver Plating
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United States of America Patent
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Issued Date -
Dec 13, 2007
app pub date -
Jun 7, 2007
filing date -
Jun 9, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention provides a method for silver plating using a non-cyanide acid silver plating bath to form a silver plating film exhibiting good adhesiveness while suppressing dissolution of resist in pattern plating. The method includes conducting strike plating using a non-cyanide acid strike plating bath prior to the silver plating.
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