Assembly having stacked die mounted on substrate
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United States of America Patent
Stats
-
Jan 22, 2013
Grant Date -
Dec 13, 2007
app pub date -
May 3, 2007
filing date -
Apr 13, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides an apparatus for vertically interconnecting semiconductor die, integrated circuit die, or multiple die segments. Metal rerouting interconnects which extend to one or more sides of the die or segment can be optionally added to the die or multi die segment to provide edge bonding pads upon the surface of the die for external electrical connection points. After the metal rerouting interconnect has been added to the die on the wafer, the wafer is optionally thinned and each die or multiple die segment is singulated from the wafer by cutting or other appropriate singulation method. After the die or multiple die segments are singulated or cut from the wafer, insulation is applied to all surfaces of the die or multiple die segments, openings are made in the insulation above the desired electrical connection pads, and the die or multiple die segments are placed on top of one another to form a stack. Vertically adjacent segments in the stack are electrically interconnected by attaching a short flexible bond wire or bond ribbon to the exposed electrical connection pad at the peripheral edges of the die which protrudes horizontally from the die and applying electrically conductive polymer, or epoxy, filaments or lines to one or more sides of the stack.
First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- INVENSAS CORPORATION
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Almen, Donald | San Martin, US | 5 | 594 |
Jacobsen, Larry | Bend, US | 5 | 594 |
Robinson, Marc E | San Jose, US | 16 | 1310 |
Vindasius, Alfons | Saratoga, US | 9 | 852 |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 22, 2024 |
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Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
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