Thermosiphon with thermoelectrically enhanced spreader plate
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United States of America Patent
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N/A
Issued Date -
Dec 20, 2007
app pub date -
Jun 15, 2006
filing date -
Jun 15, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A cooling assembly includes a plate having a center portion for engaging and transferring heat from the electronic device and a peripheral portion surrounding the center portion. A heat sink overlies the plate and receives heat from the plate. A thermoelectric module is disposed between the peripheral portion of the plate and the heat sink for pumping heat laterally from the center portion of the plate to the peripheral portion of the plate and then to the heat sink.
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