System and method for thermal management and gradient reduction
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United States of America Patent
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Issued Date -
Dec 20, 2007
app pub date -
Jun 19, 2006
filing date -
Jun 19, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head, which provide a coolant flow onto the IC. A flow inducing injector is provided that directs a fluid jet onto zones where stagnation of the coolant flow is present. This reduces or eliminates any stagnation points and enhance temperature uniformity over the area of the IC.
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