MODULAR LIQUID COOLING OF ELECTRONIC COMPONENTS WHILE PRESERVING DATA CENTER INTEGRITY
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 27, 2007
app pub date -
Jun 23, 2006
filing date -
Jun 23, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The integrity of the data center cooling system is maintained by using separate and independent cooling loops to collect heat from electronic components housed in modular units. According to one embodiment of the present invention, a first cooling loop is associated with each modular unit. The first cooling loop comprises a coolant that accepts heat from electronic components housed within the modular unit and transports the heat to a heat exchanging system. The heat exchanging system conducts heat from the coolant of the first loop to coolant associated with the data center cooling system. Coolant from the data center cooling system accepts heat from the coolant associated with the first loop and conveys it away from the data center.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully