Process for increasing the adhesion of a metal surface to a polymer
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United States of America Patent
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Issued Date -
Jan 3, 2008
app pub date -
Jun 30, 2006
filing date -
Jun 30, 2006
priority date (Note) -
Abandoned
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Abstract
A process for increasing the adhesion between a copper or copper alloy surface and a polymeric material is disclosed. The process comprises treating the copper or copper alloy surface with an aqueous solution of cupric ions at a pH from 2.8 to 4.2 to form an oxide conversion coating on the copper or copper alloy surface. The so treated surface can then be bonded to the polymeric material.
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