Stacked, interconnected semiconductor packages
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United States of America Patent
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Jun 23, 2009
Grant Date -
Jan 3, 2008
app pub date -
Jun 29, 2006
filing date -
Jun 29, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically coupling the stacked semiconductor packages.
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