Head gimbal assembly to reduce slider distortion due to thermal stress
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United States of America Patent
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-
Sep 22, 2009
Grant Date -
Jan 3, 2008
app pub date -
Jun 30, 2006
filing date -
Jun 30, 2006
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A head gimbal assembly (HGA) is provided. The HGA includes a suspension that has a suspension coefficient of thermal expansion (CTE) and a slider that has a slider CTE. A bonding element attaches the slider to the suspension. A compensation layer, having a compensation CTE, is located on the suspension. The compensation layer serves to compensate for a thermal distortion of the slider. A method of forming a HGA is also provided. The method includes providing a suspension having a suspension CTE and forming a slider having a slider CTE. The method further includes attaching the slider to the suspension and depositing a compensation layer, having a compensation CTE, on the suspension. The compensation layer serves to compensate for a thermal distortion of the slider.
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