Memory supermodule utilizing point to point serial data links
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United States of America Patent
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Issued Date -
Jan 3, 2008
app pub date -
Jun 29, 2006
filing date -
Jun 29, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A memory supermodule containing two or more memory modules disposed on a common circuit board. Also, a memory supermodule comprising two or more memory modules, each module comprising a circuit board, the circuit boards connected by a flexible circuit. All modules in a supermodule share a single set of contact pads for establishing signal connection with a system in which the supermodule is used.
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