Method for the manufacture of printed circuit boards with plated resistors
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United States of America Patent
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app pub date -
Sep 4, 2007
filing date -
Feb 15, 2001
priority date (Note) -
Abandoned
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Abstract
A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
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