Importance

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Abstract

A method of fabricating a memory card. The method comprises the initial step of providing a leadframe which has a dambar and a plurality of contacts, each of the contacts being attached to the dambar by at least one tie bar. A molded first body section is formed on the leadframe subsequent to the electrical connection of a semiconductor die thereto such that portions of the leadframe other than for the contacts thereof are covered by the first body section. After the tie bars and dambar have been removed from the leadframe, a second body section is formed on the contacts of the leadframe such that portions of the contacts are exposed in a common exterior surface of the second body section. The second body section defines the leading edge of the memory card which has no metal of the leadframe exposed therein.

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First Claim