Liquid processing apparatus and liquid processing method
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United States of America Patent
Stats
-
Apr 8, 2008
Grant Date -
Jan 10, 2008
app pub date -
Aug 22, 2007
filing date -
Apr 16, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A cleaning processing apparatus comprises a spin chuck for holding a wafer W, an under plate being positioned to face the back surface of the wafer W with a prescribed gap provided therebetween, a support member for supporting the under plate, and a nozzle hole formed to extended through the plate member and the support member. A chemical liquid, a pure water and a gas can be supplied into a nozzle hole through opening-closing valves, and the chemical liquid and the pure water remaining inside the nozzle hole can be sucked by a sucking device. A pure water remaining inside the nozzle hole is sucked and removed by using the sucking device after the processing of the wafer W with a pure water and, then, a gas is spurted onto the back surface of the wafer W.
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