Structure and method to form multilayer embedded stressors

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United States of America Patent

PATENT NO 7618866
APP PUB NO 20080006818A1
SERIAL NO

11423227

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A multilayer embedded stressor having a graded dopant profile for use in a semiconductor structure for inducing strain on a device channel region is provided. The inventive multilayer stressor is formed within areas of a semiconductor structure in which source/drain regions are typically located. The inventive multilayer stressor includes a first conformal epi semiconductor layer that is undoped or lightly doped and a second epi semiconductor layer that is highly dopant relative to the first epi semiconductor layer. The first and second epi semiconductor layers each have the same lattice constant, which is different from that of the substrate they are embedded in. The structure including the inventive multilayer embedded stressor achieves a good balance between stress proximity and short channel effects, and even eliminates or substantially reduces any possible defects that are typically generated during formation of the deep source/drain regions.

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Patent Owner(s)

Patent OwnerAddress
ELPIS TECHNOLOGIES INC1891 ROBERSTON ROAD SUITE 100 OTTAWA K2H 5B7

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Amos, Ricky S Rhinebeck , US 14 427
Luo, Zhijiong Carmel , US 255 4762
Rovedo, Nivo Lagrangeville , US 46 1221
Utomo, Henry K Newburgh , US 71 1502

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