POLYETHYLENE-BASED RESIN MOLDING MATERIAL
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United States of America Patent
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Issued Date -
Jan 17, 2008
app pub date -
Jun 22, 2007
filing date -
Jul 14, 2006
priority date (Note) -
Abandoned
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Abstract
A polyethylene-based resin molding material having an ethylene-based polymer in an amount from .gtoreq.20% to <30% by weight that has a high load melt flow rate (HLMFR) at a temperature of 190.degree. C. under a load of 21.6 kg of 0.1 to 1.0 g/l0 min and a density of 0.910 to 0.930 g/cm3; and an ethylene-based polymer in an amount from >70% to .ltoreq.80% by weight that has a melt flow rate (MFR) at a temperature of 190.degree. C. under a load of 2.16 kg of .gtoreq.150 g/10 min to <400 g/10 min and a density of .gtoreq.0.960 g/cm3; and wherein the polyethylene-based resin molding material has an MFR from .gtoreq.0.4 g/10 min to <2.0 g/10 min, an HLMFR from .gtoreq.70 g/10 min to <180 g/10 min, an HLMFR/MFR of 100 to 200, and a density from .gtoreq.0.953 g/cm3 to <0.965 g/cm3.
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