METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTEGRATED CIRCUITS

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United States of America Patent

APP PUB NO 20080013298A1
SERIAL NO

11457626

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods and apparatus provide a sensor having an integrated component coupled to a leadframe. In one embodiment, a sensor includes external leads on an opposite side of a die from the integrated component. In another embodiment, a leadframe includes a slot to reduce eddy currents.

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Patent Owner(s)

Patent OwnerAddress
ALLEGRO MICROSYSTEMS INC363 PLANTATION STREET WORCESTER MA 01605

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ararao, Virgil Rutland, MA 13 524
Doogue, Kirsten Manchester, NH 7 333
Engel, Raymond W Southbridge, MA 13 912
Gagnon, Jay Holden, MA 13 832
Magpantay, Leonardo T Paranaque City, PH 2 171
Sharma, Nirmal Shrewsbury, MA 18 980
Taylor, William P Amherst, NH 166 5628

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