Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device
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United States of America Patent
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Jul 31, 2012
Issued Date -
N/A
app pub date -
Jul 17, 2007
filing date -
Jul 18, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A mounting structure and a mounting method which are capable of securely electrically connecting wiring on a board and a device to each other in the case where the device is mounted on the board, and are capable of forming a finer bump, and increasing the number of pins are provided. A device includes at least one projection having a structure in which a surface of at least a tip part of a projecting section made of an elastic body is coated with a conductive film.
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