Manufacturing method of semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8048735
APP PUB NO 20080020540A1
SERIAL NO

11764073

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Abstract

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The present invention provides an MIM capacitor using a high-k dielectric film preventing degradation of breakdown field strength of the MIM capacitor and suppressing the increase of the leakage current. The MIM capacitor comprises a first metal interconnect, a fabricated capacitance film, a fabricated upper electrode, and a third metal interconnect. The MIM capacitor is realized by forming an interlayer dielectric film comprising silicon oxide so as to cover the first metal interconnect, then forming a first opening in the interlayer dielectric film to a region corresponding to a via hole layer in the interlayer dielectric film just above the first metal interconnect so as not to expose the upper surface of the first metal interconnect, then forming a second opening to the inside of the first opening so as to expose the surface of the first metal interconnect and then forming a capacitance film and a third metal interconnect.

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujiwara, Tsuyoshi Hamura, JP 48 881
Imai, Toshinori Ome, JP 35 439
Takeda, Kenichi Tokorozawa, JP 148 1821

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