Semiconductor wafer surface protecting sheet and semiconductor wafer protecting method using such protecting sheet
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United States of America Patent
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app pub date -
Jul 16, 2007
filing date -
Feb 18, 2005
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Abstract
A semiconductor wafer surface protection sheet which can prevent breakage of a semiconductor wafer even when a circuit-formed surface of the semiconductor wafer has a significant unevenness, and a method for protecting the semiconductor wafer by using such protection sheet. The semiconductor wafer surface protection sheet includes at least one resin layer (A) satisfying a relationship of G' (60)/G' (25)<0.1, where G' (25) is a storage elastic modulus at 25.degree. C., and G' (60) is a storage elastic modulus at 60.degree. C. The semiconductor wafer protecting method using such sheet is also provided.
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