Single chip USB packages by various assembly methods
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United States of America Patent
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-
Nov 4, 2008
Grant Date -
Jan 24, 2008
app pub date -
Sep 21, 2007
filing date -
Aug 4, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component and an external case. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The modular USB core component is then inserted or otherwise combined with an external plastic case to provide a USB assembly. An optional carrying case is disclosed.
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