Compound Machining Method and Apparatus

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United States of America Patent

APP PUB NO 20080025808A1
SERIAL NO

11828233

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A milling tool and a workpiece each may be rotated at a rotational velocity of at least 25 m/min in a compound machining operation. Disclosed are a computer numerically controlled machine, a method for operation of a computer numerically controlled machine, a computer program product, and a method for determining compound machining parameters. In some embodiments, a processing parameter for compound machining is selected and other processing parameters are algorithmically determined based thereon.

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Patent Owner(s)

Patent OwnerAddress
MORI SEIKI USA INC5655 MEADOWBROOK DRIVE ROLLING MEADOWS IL 60008

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chaphalkar, Nitin Mount Prospect, IL 15 103
Hyatt, Gregory South Barrington, IL 10 68

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