Method and system for handling process related variations for integrated circuits based upon reflections
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United States of America Patent
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Dec 14, 2010
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app pub date -
Jun 26, 2007
filing date -
Jun 7, 2002
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Abstract
Disclosed is an approach for modeling and correcting for the effects of reflections during lithography processing. Thickness differences across the surfaces in different integrated circuit layers may result in reflectance-related variations. The variations may be modeled and accounted for during the design process for the integrated circuit.
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