High density connector and method of manufacture
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United States of America Patent
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-
Jan 13, 2009
Grant Date -
Feb 7, 2008
app pub date -
Jan 29, 2007
filing date -
Oct 10, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.
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