Process for precision placement of integrated circuit overcoat material
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United States of America Patent
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Jan 19, 2010
Grant Date -
Feb 14, 2008
app pub date -
Aug 11, 2006
filing date -
Aug 11, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides a process for manufacturing an integrated circuit (IC) package and an integrated circuit (IC) package. The process, without limitation, includes providing an integrated circuit chip having a configuration, and forming a layer of overcoat material over the integrated circuit chip based upon the configuration.
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