REINFORCED MICRO-ELECTROMECHANICAL SYSTEM PACKAGE STRUCTURE
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United States of America Patent
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Issued Date -
Feb 14, 2008
app pub date -
Aug 10, 2006
filing date -
Aug 10, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention discloses a reinforced MEMS package structure, wherein after the wire-bonding process and before the molding process, an extra resin coating process is used to apply a protective resin onto the MEMS chip, the controller chip, the wires and a portion of the lead frame and provide an extra protection for the MEMS structure lest the MEMS structure be damaged by stress, thermal stress, or external force. Thereby, a reinforced MEMS package structure with a higher strength and a smaller size is achieved.
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