Probes and methods for semiconductor wafer analysis
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United States of America Patent
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Issued Date -
Feb 14, 2008
app pub date -
Jul 27, 2007
filing date -
Jul 27, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A probe adapted for characterization of a semiconductor wafer having a surface. In one embodiment, the probe includes a source of modulated light; an optical fiber in optical communication with the source of modulated light, the optical fiber having a face and comprises a fiber core; and a transparent conductive layer coating the face of the optical fiber. Light from the source of modulated light is directed along the fiber core of the optical fiber through the face of the optical fiber to the surface of the semiconductor wafer. The optically transparent conductive layer detects charges from the surface of the semiconductor wafer.
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