Indium adsorbent and indium fractioning method

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United States of America Patent

PATENT NO 7611631
APP PUB NO 20080038188A1
SERIAL NO

11631898

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Abstract

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The invention provides an indium adsorbent that can cause indium to be adsorbed, and a simple and inexpensive indium fractioning method for isolating and recovering high-purity indium from an acid solution whose primary component is hydrochloric acid and that contains indium. A primary component of the indium adsorbent is an anion-exchange resin that has a crosslinked structure produced by the copolymerization of styrene or acrylamide and divinylbenzene, and at least one of a quaternary ammonium group and a tertiary ammonium group, and that is provided with an acid-adsorbing ability. An acid solution whose primary component is hydrochloric acid and that includes indium is brought into contact with the anion-exchange resin to cause indium to be adsorbed to the anion-exchange resin.

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Patent Owner(s)

Patent OwnerAddress
SHARP KABUSHIKI KAISHA22-22 NAGAIKE-CHO ABENO-KU OSAKA-SHI OSAKA 545-8522
AQUATECH CORPORATION2-7-12 SHIMAYA 4-CHOME KONOHANA-KU OSAKA-SHI OSAKA 554-0024

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Doi, Hideki Osaka , JP 13 93
Fujiwara, Nobuaki Osaka , JP 7 101
Honma, Takamichi Osaka , JP 5 23
Matsunami, Toyokazu Osaka , JP 2 10
Muratani, Toshiaki Osaka , JP 6 26
Nishikawa, Shoji Osaka , JP 12 311
Ohnishi, Akifusai Osaka , JP 1 5
Tsubota, Hiroshi Osaka , JP 2 17
Yamasaki, Shinichi Osaka , JP 16 80

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