Electrolytic looping for forming layering in the deposit of a coating
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United States of America Patent
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Issued Date -
Feb 21, 2008
app pub date -
Aug 9, 2006
filing date -
Aug 9, 2006
priority date (Note) -
Abandoned
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Abstract
A method for depositing a metal onto a substrate including the steps of providing a plating bath including ions of the metal, positioning the substrate in the plating bath, positioning at least one counter electrode in the plating bath, performing a first electrolytic process for a predetermined first period of time, performing a second electrolytic process for a predetermined second period of time and looping between the first and second electrolytic processes to form a coating of the metal on the substrate.
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