Importance

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Abstract

A semiconductor package having laser-embedded terminals provides a high-density and low cost internal/external mounting and interconnect structure for integrated circuits. A substrate for interconnecting one or more dies to external terminals of the semiconductor package is fabricated with terminal lands buried inside the dielectric. The terminal lands are exposed by laser-ablation and then terminal material is added within the holes formed by the laser-ablation. The dielectric is again ablated to reduce the height of the substrate and further expose the terminals to form the final semiconductor package. The terminal material may be solder so that curved 'solder ball' hemispherical surfaces are provided on an exposed surface of the semiconductor package. Alternatively, in concert the terminal may be internal terminals or posts for connecting a semiconductor die to the substrate within the semiconductor package.

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First Claim