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Abstract

In order to measure the temperature of an object to be processed that has a high infrared transparency in a lamp-heater-equipped chamber filled with an erosive gas, the following measures are taken. A groove is formed in a stage for holding a single silicon wafer substrate attached on the top of a lamp heater or in an enclosure made from quartz and the like provided on a light emitting open section side of the lamp heater so that a thermocouple to be embedded does not contact the erosive gas. To address the issue described above, an equivalent of an object to be processed, namely a small piece of a silicon wafer substrate, is bonded to the thermocouple. Prior to temperature measurement, the difference between a measured temperature of a silicon wafer substrate to be measured placed on the surface of the stage and a measured temperature of the small silicon wafer piece is measured. The difference in thermal capacity between the silicon wafer substrate and the silicon wafer substrate piece is corrected. Using the apparatus and method, the temperature of the silicon wafer substrate can be measured.

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First Claim