Tin-Based Plating Film and Method for Forming the Same
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United States of America Patent
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Issued Date -
Feb 28, 2008
app pub date -
May 27, 2005
filing date -
Jun 21, 2004
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Abandoned
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Abstract
The present invention provides a tin-based two-layered plating film exhibiting suppressed whisker growth comprising a lower layer of a tin plating film or tin alloy plating film comprising 5% by weight or less of at least one metal selected from the group consisting of cobalt, copper, bismuth, silver, and indium, and 95% by weight or more of tin, and an upper layer of a tin plating film or tin alloy plating film comprising 5% by weight or less of at least one metal selected from the group consisting of cobalt, copper, bismuth, silver and indium, and 95% by weight or more of tin. The tin-based plating film of the present invention is a lead-free tin plating film or tin alloy plating film, exhibits suppressed whisker growth over an extended period, and can further be formed relatively easily without complicated steps.
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