Soldering flux and solder paste composition
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United States of America Patent
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Issued Date -
Mar 6, 2008
app pub date -
Sep 5, 2007
filing date -
Sep 5, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A soldering flux contains a base resin and an activating agent. The base resin contains a thermoplastic acrylic resin having a glass transition temperature of below -50.degree. C. This enables to sufficiently suppress the occurrence of cracks in the flux residue after soldering, under the severe environment where the temperature difference is extremely large. The soldering flux has high reliability and excellent solderability, and is conventional with respect to the load against manufacturing cost and environment.
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