Importance

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Abstract

The present disclosure relates to an improved integrated circuit package with a encapsulant retention structure located adjacent to a packaged integrated chip on a substrate. The structure allows for the placement and retention of a larger quantity of encapsulant to seep under the packaged integrated chip. The retention wall placed on the substrate alternatively serves as substrate stiffener able to maintain mechanical properties to be used with a more desirable thinner substrate. In one embodiment, the use of openings and recesses in a stiffener layer of an integrated circuit package houses a passive electronic component to maintain mechanical properties when a thinner substrate is used. The use of either a retention wall or a stiffener allows for the manufacture of these integrated circuit package using strip, matrix, or array technology where a larger board with a plurality of integrated circuit packages is produced industrially and then cut to individual units. The use of a retention wall of a stiffener layer over an expensive substrate layer allows for the use of disposable edges around the strip including indexing holes or other holding mechanisms. What is also contemplated is a method of manufacture of a compact strip, matrix, or array comprised of a plurality of integrated circuit packages where no waste or additional cuts are needed to produce individual integrated circuit packages.

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First Claim