Fluid Supply Method and Apparatus
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United States of America Patent
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Issued Date -
Mar 6, 2008
app pub date -
Sep 19, 2005
filing date -
Sep 18, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method and apparatus for supplying fluid to a deposition device or printhead using the through flow principle. The pressure of fluid entering and exiting the printhead is controlled directly at the printhead by respective pressure controllers, preferably a transducer and control system or a weir. The pressure controllers can be integrated together and mounted on or further integrated with the printhead. The supply system preferably forms a closed loop including a remote reservoir, and the entire system can be arranged such that the overall free surface of fluid is exposed on average to a negative gauge pressure.
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