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Abstract

A heat dissipation substrate for an electronic device comprises a first metal layer, a second metal layer, and a thermally conductive polymer dielectric insulating layer. A surface of the first metal layer carries the electronic device, e.g., a light-emitting diode (LED) device. The thermally conductive polymer dielectric insulating layer is stacked between the first metal layer and the second metal layer in a physical contact manner, and interfaces therebetween include at least one micro-rough surface with a roughness Rz larger than 7.0. The micro-rough surface includes a plurality of nodular projections, and the grain sizes of the nodular projections mainly are in a range of 0.1-100 .mu.m. The heat dissipation substrate has a thermal conductivity larger than 1.0 W/mK, and a thickness smaller than 0.5 mm, and comprises (1) a fluorine-containing polymer with a melting point higher than 150.degree. C. and a volume percentage in a range of 30-60%, and (2) thermally conductive filler dispersed in the fluorine-containing polymer and having a volume percentage in a range of 40-70%.

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First Claim