Multi-layer cable design and method of manufacture

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20080060832A1
SERIAL NO

11895746

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A novel method of designing and fabricating flexible and lightweight cable [100] having a central conductor [110], a dielectric layer [130], an outer conductor [150] and an insulation coating [170] using thin film technology is disclosed. The dielectric layer [130] is `grown` on dielectric layer [130] using electrophoretic deposition to a specified thickness, based upon its intended use. It may include nano-diamonds. Ion beam assisted deposition is used to metalize the cable dielectric layer [130]. This may be ion beam assisted sputtering, ion beam assisted evaporative deposition or ion beam assisted cathodic arc deposition. In an alternative embodiment, the outer conductor may be etched to provide greater flexibility, or to add a piezoelectric layer. The central conductor [110] may be created from dielectric fibers [113] which are metalized as described above. The piezoelectric layer added to create ultrasonic transducer cables.

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Patent Owner(s)

Patent OwnerAddress
RAZAVI ALINot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Razavi, Ali Dallas, PA 14 451

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