Impregnating Resin Formulation
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United States of America Patent
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Issued Date -
Mar 13, 2008
app pub date -
Jun 8, 2005
filing date -
Jun 11, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The invention relates to an impregnating resin formulation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabilizers, additives and rheology additives. Said invention also relates to the use thereof in order to impregnate windings for the production of base materials of flat isolating material and in order to cover printed circuit boards.
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