INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK
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United States of America Patent
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app pub date -
Sep 15, 2006
filing date -
Sep 15, 2006
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Abandoned
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Abstract
An integrated circuit package system is provided including forming a paddle having a depression from a paddle top surface and an external interconnect, forming a lead tip and a lead body of the external interconnect, connecting a device over the paddle top surface and the external interconnect, and filling a substantially electrically nonconductive material in the depression.
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