Stacked die semiconductor device having circuit tape
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United States of America Patent
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Feb 9, 2010
Issued Date -
N/A
app pub date -
Sep 15, 2006
filing date -
Sep 15, 2006
priority date (Note) -
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Abstract
A stacked die semiconductor package includes a first integrated circuit chip, a first circuit tape coupled to the first integrated circuit chip, a second integrated circuit chip coupled to the first circuit tape, and at least one component coupled to the first circuit tape. The at least one component may include one or more passive components, one or more active components, or a combination of passive and active components. The stacked die semiconductor package can also include a second circuit tape coupled to the second integrated circuit chip and a third integrated circuit chip coupled to the second circuit tape. The stacked die semiconductor package can also include an encapsulant.
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