Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 24, 2012
Grant Date -
Mar 20, 2008
app pub date -
Jun 28, 2007
filing date -
Jun 29, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs are provided. One method includes generating simulated images illustrating how each of the different reticle designs will be printed on a wafer at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in each of the different reticle designs using the simulated images. In addition, the method includes determining a process window for the wafer printing process for each of the different reticle designs based on results of the detecting step.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully