Metal removing solution and metal removing method using the same

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United States of America Patent

APP PUB NO 20080073614A1
SERIAL NO

11903837

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A metal removing solution of the present invention is a solution for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, and the metal removing solution contains a chain thiocarbonyl compound. A removing method of the present invention for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy is a method for selectively removing a metal other than copper or copper alloy, from a system that includes copper or copper alloy and at least one selected from palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, by using a metal removing solution containing a chain thiocarbonyl compound. Thus, the present invention provides the metal removing solution capable of removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, the solution having an excellent property of removing palladium, tin, silver, palladium alloy, silver alloy, tin alloy, and the like without attacking copper, and having an excellent handleability since the solution does not contain any toxic substance; and the removing method using the foregoing metal removing solution.

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Patent Owner(s)

Patent OwnerAddress
MEC COMPANY LTD1 HIGASHIHATSUSHIMA-CHO AMAGASAKI-SHI HYOGO 660-0832

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akiyama, Daisaku Hyogo, JP 11 109
Katayama, Daisuke Hyogo, JP 22 74

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