Method of uniform phosphor chip coating and LED package fabricated using method
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United States of America Patent
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May 17, 2011
Grant Date -
Apr 3, 2008
app pub date -
Jul 27, 2007
filing date -
Jul 31, 2006
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Methods for fabricating LED packages comprising providing an LED chip and covering at least part of it with a liquid medium. An optical element is provided and placed on the liquid medium. The optical element is allowed to settle to a desired level and the liquid medium is cured. LED packages are also disclosed that are fabricated using the disclosed methods.
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