Linear semiconductor processing facilities
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United States of America Patent
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Jun 14, 2011
Grant Date -
Apr 10, 2008
app pub date -
Aug 28, 2007
filing date -
Nov 10, 2003
priority date (Note) -
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Abstract
Methods and systems are provided for handling materials, including materials used in semiconductor manufacturing systems. The methods and systems include linear semiconductor processing facilities for vacuum-based semiconductor processing and handling, as well as linkable or extensible semiconductor processing facilities that can be flexibly configured to meet a variety of constraints.
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