CIRCUIT BOARD ASSEMBLIES WITH COMBINED FLUID-CONTAINING HEATSPREADER-GROUND PLANE AND METHODS THEREFOR
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United States of America Patent
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N/A
Issued Date -
Apr 17, 2008
app pub date -
Oct 12, 2007
filing date -
Oct 13, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Circuit board assemblies and methods that employ integrated heatspreaders to cool the assemblies and serve as electrical ground planes for the assemblies. Such a circuit board assembly includes a substrate having at least one circuit device on at least a first surface thereof and an electrical ground plane. The circuit device has a first set of solder connections electrically connected to the electrical ground plane and a second set of solder connections electrically connected to power and signal traces on the first surface of the substrate. The assembly further includes a heatspreader embedded in the substrate and defining an electrical element of the electrical ground plane as a result of being electrically connected to the first set of solder connections. The heatspreader is configured as a plate-mesh-plate laminate that defines a cavity containing a fluid for transferring heat from the circuit device.
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