Interconnected two-substrate layer touchpad capacitive sensing device

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United States of America Patent

APP PUB NO 20080088595A1
SERIAL NO

11580607

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Abstract

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A touch-sensor device has a first board coupled to a second board. The first board has a first substrate with a first plurality of sensing elements and a second plurality of sensing elements. A first plurality of conductive trace connects the first plurality of sensing elements along a first axis. A dielectric material is formed on the first plurality of sensing elements and on the first plurality of conductive traces. The second board has a second substrate and a second plurality of conductive traces that connects the second plurality of sensing elements along a second axis.

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Patent Owner(s)

Patent OwnerAddress
CYPRESS SEMICONDUCTOR CORPORATION198 CHAMPION COURT SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liu, Hua Shanghai, CN 177 1364
Xiao-Ping, Weng Shanghai, CN 3 226

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